Masaki Sanada

Title: Masaki Sanada: Innovator in Pad Structures and Solder Bump Technologies

Introduction

Masaki Sanada is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of electronics through his innovative designs and methods. With a total of 4 patents to his name, Sanada continues to push the boundaries of technology.

Latest Patents

Sanada's latest patents include a pad structure and a solder bump forming method. The pad structure features an insulating layer, a first metal layer that includes an intermetallic compound layer of copper and tin or a tin layer, and a second metal layer that consists of a gold layer. The solder bump forming method involves a reflow treatment over a conductive ball mounted on multiple pads. This method includes several steps: forming a metal film capable of chemically reacting to a tackifying compound on the pads, creating an organic sticking layer through a chemical reaction, and finally, mounting the conductive ball on the pads.

Career Highlights

Sanada is currently employed at Shinko Electric Industries Co., Ltd., where he applies his expertise in developing advanced electronic components. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Some of his notable coworkers include Masao Nakazawa and Kei Imafuji, who have collaborated with him on various projects within the company.

Conclusion

Masaki Sanada's innovative contributions to pad structures and solder bump technologies highlight his role as a key figure in the electronics industry. His patents reflect a commitment to advancing technology and improving electronic component design.