Shinko Electric Industries Co., Ltd.

Masaki Sanada

Masao Nakazawa

Kei Imafuji

Tadashi Kodaira

Masaru Yamazaki

Syota Miki

Sachiko Oda

Kinji Nagata

Kenjiro Enoki

A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.

Pad structure and mounted structure

A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Solder bump forming method

The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electroless gold plating solution.

Non-cyanide electroless gold plating solution and process for electroless gold plating

The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof:X&#x2014;(CH)&#x2014;SHwherein n is 2 or 3 and X is SOH or NH, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

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Nagano, Japan

Masaki Sanada