The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Jun. 13, 2014
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Masaki Sanada, Nagano, JP;
Syota Miki, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/8182 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81444 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/113 (2013.01); H05K 3/3436 (2013.01); H05K 3/4015 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10515 (2013.01);
Abstract
A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.