The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Jul. 16, 2008
Kei Imafuji, Nagano, JP;
Masao Nakazawa, Nagano, JP;
Masaki Sanada, Nagano, JP;
Sachiko Oda, Nagano, JP;
Tadashi Kodaira, Nagano, JP;
Kinji Nagata, Nagano, JP;
Masaru Yamazaki, Nagano, JP;
Kenjiro Enoki, Nagano, JP;
Kei Imafuji, Nagano, JP;
Masao Nakazawa, Nagano, JP;
Masaki Sanada, Nagano, JP;
Sachiko Oda, Nagano, JP;
Tadashi Kodaira, Nagano, JP;
Kinji Nagata, Nagano, JP;
Masaru Yamazaki, Nagano, JP;
Kenjiro Enoki, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.