Tokyo, Japan

Masakazu Terada


Average Co-Inventor Count = 5.3

ph-index = 5

Forward Citations = 111(Granted Patents)


Location History:

  • Kariya, JP (1993 - 1996)
  • Chiryu, JP (2001 - 2002)
  • Tokyo, JP (2006)

Company Filing History:


Years Active: 1993-2006

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5 patents (USPTO):Explore Patents

Title: Masakazu Terada: Innovator in Semiconductor and Circuit Board Technologies

Introduction

Masakazu Terada is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of semiconductor technology and printed circuit board manufacturing. With a total of 5 patents to his name, Terada's work has had a lasting impact on the industry.

Latest Patents

One of Terada's latest patents is a manufacturing method of a rigid-flexible printed circuit board and the structure thereof. In this method, slits for defining two sides of a removing portion are formed in a part of multiple resin films. These resin films are then stacked and bonded to create a circuit board. A product portion is subsequently cut from the circuit board. Before bonding, a separation sheet is placed between predetermined adjacent layers of the resin films to separate the removing portion from the residual portion of the product. This innovative approach ensures that while the product portion is cut, the removing portion is effectively separated.

Another notable patent is related to the manufacturing method of a semiconductor substrate and a semiconductor pressure sensor. In this method, a concavity and a connecting hole are formed on the lower face of a first substrate. This substrate is then laminated with a second substrate in an atmospheric pressure environment. A diaphragm is created by thinning the first substrate from its upper face through polishing. A sealing hole is formed, reaching the connecting hole, and an oxide film is created in the sealing hole under vacuum conditions. This process effectively seals the connecting hole while reducing the pressure in the pressure reference chamber, preventing diaphragm deformation during polishing.

Career Highlights

Throughout his career, Masakazu Terada has worked with notable companies such as Denso Corporation and Nippondenso Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in his field.

Collaborations

Terada has collaborated with several talented individuals, including Minekazu Sakai and Tsuyoshi Fukada. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Masakazu Terada is a distinguished inventor whose work in semiconductor and circuit board technologies has paved the way for advancements in these fields. His innovative patents and collaborations highlight his significant contributions to the industry.

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