The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Mar. 07, 2003
Koji Kondo, Toyohashi, JP;
Satoshi Takeuchi, Nagoya, JP;
Tomohiro Yokochi, Kariya, JP;
Katsumi Yamazaki, Tokyo, JP;
Masakazu Terada, Tokyo, JP;
Koji Kondo, Toyohashi, JP;
Satoshi Takeuchi, Nagoya, JP;
Tomohiro Yokochi, Kariya, JP;
Katsumi Yamazaki, Tokyo, JP;
Masakazu Terada, Tokyo, JP;
Denso Corporation, Kariya, JP;
Abstract
In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.