This inventor holds 7 USPTO granted patents and 1 EPO patent. Top assignee: Texas Instruments Corporation. Active years: 1994-2014.
Location History:
- Dallas, TX (US) (2002)
- Richardson, TX (US) (1994 - 2014)
Company Filing History:
Years Active: 1994-2014
Title: Mark A Kressley: Innovator in Microelectromechanical Systems
Introduction
Mark A Kressley is a prominent inventor based in Richardson, TX (US). He has made significant contributions to the field of microelectromechanical systems (MEMS) with a total of 7 patents to his name. His innovative work has paved the way for advancements in electronic device packaging.
Latest Patents
Kressley's latest patents include a method for packaging a microelectromechanical system (MEMS) device. This invention features a ceramic header designed to form a portion of an electronic device package. The ceramic header includes a mounting portion that provides a surface for the electronic device. Additionally, it incorporates one or more conductive input-output connectors that facilitate electrical connections between the first and second surfaces of the ceramic header. The design also features one or more thermally polished surfaces, enhancing the overall functionality of the device.
Another notable patent is the ceramic header method, which shares similar attributes with his MEMS packaging method. This innovation also emphasizes the importance of the ceramic header in electronic device packaging, showcasing Kressley's expertise in this area.
Career Highlights
Mark A Kressley has built a successful career at Texas Instruments Corporation, where he has been instrumental in developing cutting-edge technologies. His work has not only contributed to the company's success but has also had a lasting impact on the industry.
Collaborations
Throughout his career, Kressley has collaborated with notable colleagues, including Dean L Frew and Arthur M Wilson. These partnerships have fostered a creative environment that has led to numerous innovations in the field.
Conclusion
Mark A Kressley is a distinguished inventor whose work in microelectromechanical systems has significantly advanced electronic device packaging. His contributions continue to influence the industry, and his innovative spirit remains a driving force in technology development.
