IDiyas

For the Inventor, By the Inventor

San Jose, CA, United States of America

Marc E Robinson

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.9

ph-index = 10

Forward Citations = 384(Granted Patents)


Company Filing History:

goldMedal7 out of 1,853 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
silverMedal5 out of 10 
 
Vertical Circuits, Inc.
 patents
bronzeMedal2 out of 16 
 
Cubic Memory, Inc.
 patents
4. 1 out of 1 
 
Vertical Circuits (assignment for the Benefit of Creditors), LLC
 patent

Years Active: 2000-2017

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15 patents (USPTO):
1. 9824999 - Semiconductor die mount by conformal die coating (2017-11-21),
2. 9305862 - Support mounted electrically interconnected die assembly (2016-04-05),
3. 9252116 - Semiconductor die mount by conformal die coating (2016-02-02),
4. 8729690 - Assembly having stacked die mounted on substrate (2014-05-20),
5. 8723332 - Electrically interconnected stacked die assemblies (2014-05-13),
6. 8704379 - Semiconductor die mount by conformal die coating (2014-04-22),
7. 8629543 - Electrically interconnected stacked die assemblies (2014-01-14),
8. 8357999 - Assembly having stacked die mounted on substrate (2013-01-22),
9. 8178978 - Support mounted electrically interconnected die assembly (2012-05-15),
10. 7705432 - Three dimensional six surface conformal die coating (2010-04-27),
11. 7535109 - Die assembly having electrical interconnect (2009-05-19),
12. 7245021 - Micropede stacked die component assembly (2007-07-17),
13. 7215018 - Stacked die BGA or LGA component assembly (2007-05-08),
14. 6271598 - Conductive epoxy flip-chip on chip (2001-08-07),
15. 6098278 - Method for forming conductive epoxy flip-chip on chip (2000-08-08),

Title: The Innovative Contributions of Marc E. Robinson

Introduction

Marc E. Robinson is a prominent inventor based in San Jose, California, known for his significant contributions to semiconductor technology. With a total of 15 patents to his name, Robinson has made remarkable advancements in the field, particularly in the area of semiconductor die mounting.

Latest Patents

One of Robinson's latest patents is focused on a semiconductor die mount by conformal die coating. This innovative approach provides adhesion between the die and a support without the need for additional adhesive. The conformal coating not only protects the die during assembly but also serves to electrically insulate it from any conductive parts it may contact. The coating can be made from organic polymers, such as parylene. Another notable patent involves a method for adhering a die onto a support, which may also be another die. This method includes applying a conformal coating between the die and the support and heating the coating to ensure a secure bond.

Career Highlights

Throughout his career, Marc E. Robinson has worked with several notable companies, including Adeia Semiconductor Bonding Technologies Inc. and Vertical Circuits, Inc. His work has significantly impacted the semiconductor industry, leading to advancements that enhance the performance and reliability of electronic devices.

Collaborations

Robinson has collaborated with various professionals in the field, including Simon J. S. McElrea and Larry Jacobsen. These collaborations have contributed to the development of innovative technologies and solutions in semiconductor applications.

Conclusion

Marc E. Robinson's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative approaches continue to influence the future of electronic device manufacturing.

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