The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Aug. 27, 2008
Scott Jay Crane, Aromas, CA (US);
Simon J. S. Mcelrea, Scotts Valley, CA (US);
Scott Mcgrath, Scotts Valley, CA (US);
Weiping Pan, San Jose, CA (US);
Deann Eileen Melcher, San Jose, CA (US);
Marc E. Robinson, San Jose, CA (US);
Scott Jay Crane, Aromas, CA (US);
Simon J. S. McElrea, Scotts Valley, CA (US);
Scott McGrath, Scotts Valley, CA (US);
Weiping Pan, San Jose, CA (US);
DeAnn Eileen Melcher, San Jose, CA (US);
Marc E. Robinson, San Jose, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.