The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Apr. 25, 2012
Applicants:
Simon J. S. Mcelrea, Scotts Valley, CA (US);
Marc E. Robinson, San Jose, CA (US);
Lawrence Douglas Andrews, Jr., Los Gatos, CA (US);
Inventors:
Simon J. S. McElrea, Scotts Valley, CA (US);
Marc E. Robinson, San Jose, CA (US);
Lawrence Douglas Andrews, Jr., Los Gatos, CA (US);
Assignee:
Invensas Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/50 (2006.01); H01L 23/34 (2006.01); H01L 25/16 (2006.01); H01L 21/50 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 29/06 (2006.01); H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 21/58 (2013.01); H01L 24/24 (2013.01); H01L 24/80 (2013.01); H01L 24/82 (2013.01); H01L 25/0657 (2013.01); H01L 29/0657 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82102 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01);
Abstract
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.