Manabu Bonkohara

Title: Manabu Bonkohara: Innovator in Semiconductor Technology

Introduction

Manabu Bonkohara, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor technology. With a total of 14 patents to his name, Bonkohara's work focuses primarily on innovative semiconductor packaging solutions that enhance performance and reliability.

Latest Patents

Among his latest patents, the "Semiconductor Packing Stack Module and Method of Producing the Same" stands out. This invention describes a semiconductor package stack module where a Large Scale Integrated circuit (LSI) is mounted using fine bumps on either a ceramic carrier substrate or a flexible carrier film that features formed wiring conductors. The process includes injecting seal resin and thinning the chip, followed by connecting multiple carrier substrates or films via bumps and through holes linked to the wiring conductors. This tridimensional stack module is designed to deliver a miniature, thin, dense, low-cost, and highly reliable structure without the need for wire bonding or a Tape Automated Bonding (TAB) system. Additionally, the invention boasts minimal wiring length and optimal electric characteristics.

Another noteworthy patent is the "Semiconductor Device," which involves a first bump placed on an electrode of a semiconductor chip. This patent outlines an opening formed in correspondence with the electrode, where a patterned conductive lead is situated and arranged alongside a second bump for external connectivity. The external shape of the flexible substrate closely matches that of the semiconductor chip, ensuring efficient integration and functionality.

Career Highlights

Manabu Bonkohara's career includes key roles at several prestigious companies, such as NEC Corporation and Nippon Electric Co., Ltd. His experiences at these organizations have provided him with a robust foundation in semiconductor design and technology. Bonkohara has consistently demonstrated a commitment to pushing the boundaries of innovation in his domain.

Collaborations

Throughout his career, Bonkohara has collaborated with notable figures in the semiconductor industry, including his coworkers Kenichi Tokuno and Hidetoshi Takeda. These collaborations have enhanced his work, leading to advancements in semiconductor packaging technologies and significantly contributing to research and development in the field.

Conclusion

Manabu Bonkohara's inventiveness and dedication to semiconductor technology have solidified his reputation as a leading inventor. With his impressive portfolio of patents and impactful career, Bonkohara continues to be a driving force in the evolution of semiconductor packaging solutions. His work not only reflects innovation but also significantly contributes to the advancement of electronics as a whole.