The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 1996
Filed:
Nov. 29, 1994
Masaru Saito, Tokyo, JP;
Manabu Bonkohara, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A multichip module packaging structure provided over a mother board. A multichip module substrate is mounted over the mother board through a frame member. The frame member is provided to extend successively on a peripheral region of a bottom surface of the substrate and further extend downward from the bottom surface of the substrate. The frame member also has a top portion bonded with the bottom surface of the substrate and a bottom portion bonded with the top surface of the mother substrate so as to form a three dimensional space surrounded by the frame member, the substrate and the mother board. A plurality of semiconductor integrated circuit chips are provided on the bottom surface of the substrate so that the chips are accommodated within the three dimensional space.