The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
Apr. 18, 1996
Applicant:
Inventors:
Hidetoshi Takeda, Tokyo, JP;
Manabu Bonkohara, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257668 ; 257778 ; 257780 ;
Abstract
A first bump is arranged on an electrode of a semiconductor chip. An opening portion formed at a position corresponding to an electrode on the semiconductor chip, a conductive lead subjected to patterning and arranged in the opening portion, and a second bump for being connected to the outside of the device are formed on a flexible substrate, and the conductive lead and the first bump are connected to each other in the opening portion. An external shape of the flexible substrate is approximately the same as that of the semiconductor chip.