The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1998
Filed:
Aug. 15, 1997
Applicant:
Inventors:
Kenichi Otake, Tokyo, JP;
Manabu Bonkohara, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H01L / ;
U.S. Cl.
CPC ...
361749 ; 257737 ; 257738 ; 257778 ; 361776 ; 361783 ;
Abstract
Solder balls are attached to a flexible printed-circuit board which is shaped so as to be able to cover at least an upper surface, a side surface, and a lower surface of an IC chip, and the flexible printed-circuit board is placed on the IC chip. Then, the flexible printed-circuit board is folded over edges of the IC chip, and bonded to outer surfaces of the IC chip by an adhesive sheet. Thereafter, a sealing resin is poured into a gap between the upper surface of the IC chip and the flexible printed-circuit board, and cured, thereby completing a semiconductor package.