Singapore, Singapore

Man Ho Hui


Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 72(Granted Patents)


Company Filing History:


Years Active: 2004-2005

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3 patents (USPTO):Explore Patents

Title: Innovations by Man Ho Hui: Pioneering Encapsulation Solutions in Singapore

Introduction

Man Ho Hui is a notable inventor based in Singapore, SG, who has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Hui has focused on innovative methods for encapsulating electronic devices, enhancing their performance and durability.

Latest Patents

Hui's latest inventions showcase his expertise in mold design and encapsulation techniques. One of his recent patents is a mold for encapsulating a semiconductor chip, which features two mold halves. One of these halves includes a contact section that is designed to interface with the surface of a semiconductor chip mounted within the mold during use. Another notable patent details a mold and method for encapsulating a one-sided electronic device. This mold incorporates a first section that defines a mold cavity, alongside a second section that has a recessed portion, tailored to receive a layer of material attached to a lead frame, without including the lead frame itself.

Career Highlights

Hui is currently employed at Asm Technology Singapore Pte Ltd, a company recognized for its innovation in the semiconductor industry. His work involves the design of advanced molds that facilitate the efficient encapsulation of electronic devices, significantly impacting the manufacturing process and quality of end products.

Collaborations

During his career, Hui has collaborated with notable colleagues, including Teng Hock Kuah and Shu Chuen Ho. These collaborations have likely fostered a rich environment of innovation and knowledge sharing, further driving advancements in semiconductor technologies.

Conclusion

Man Ho Hui stands out as a key figure in the realm of semiconductor innovations. Through his inventive molds and encapsulation methods, he continues to contribute significantly to the industry, demonstrating the importance of creativity and technical prowess in driving technological advancements. His achievements not only reflect his dedication to innovation but also the collaborative spirit of the field.

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