The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Jul. 09, 2001
Applicants:
Shu Chuen Ho, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Man Ho Hui, Singapore, SG;
Srikanth Narasimulau, Singapore, SG;
Murali Sarangapani, Singapore, SG;
Inventors:
Shu Chuen Ho, Singapore, SG;
Teng Hock Kuah, Singapore, SG;
Man Ho Hui, Singapore, SG;
Srikanth Narasimulau, Singapore, SG;
Murali Sarangapani, Singapore, SG;
Assignee:
ASM Technology Singapore PTE Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C045/14 ;
U.S. Cl.
CPC ...
Abstract
A mold has two mold halves (). One of the mold halves () includes a contact section () which is adapted to contact a surface () of a semiconductor chip () mounted in the mold, in use.