Asm Technology Singapore Pte Ltd

Man Ho Hui

Shu Chuen Ho

Teng Hock Kuah

Si Liang Lu

Murali Sarangapani

Jie Liu

Charles Joseph Vath, Iii

Loon Aik Lim

Juay Sim Koh

Srikanth Narasimulau

A mold has two mold halves (). One of the mold halves () includes a contact section () which is adapted to contact a surface () of a semiconductor chip () mounted in the mold, in use.

Mold for encapsulating a semiconductor chip

A mold ( ) is for molding a one-sided encapsulated electronic device. The mold ( ) includes a first mold section ( ) defining a mold cavity ( ), and a second mold section ( ) including a first recessed portion ( ) adapted to receive a layer of material ( ) attached to a leadframe ( ), but not the leadframe ( ).

Mold and method for encapsulation of electronic device

Molding apparatus ( ) is provided for simultaneously molding a molding material around a number of separate substrates, each substrate having a semiconductor chip mounted thereon. The apparatus includes a mold holder ( ) having a first holding section for holding a first mold half ( ) and a second holding section for holding a second mold half ( ). The first and second holding sections have a common support surface ( ), the support surface ( ) including a first movable member ( ) in the first holding section and a second movable member ( ) in the second holding section. The first and second movable members ( ) are movable between a first position in which they protrude out of the support surface ( ) and a second position in which the protrusion from the support surface ( ) is less than in the first position. A first drive mechanism ( ) is coupled to the first movable member ( ) and a second drive mechanism ( ) is coupled to the second movable member ( ). The first and second drive mechanisms ( ) are adapted to be independently actuated to move the first and second movable members ( ) between the first and second positions.

Molding apparatus

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Singapore, Singapore

Man Ho Hui