The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2004
Filed:
May. 02, 2002
Applicant:
Inventors:
Teng Hock Kuah, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Charles Joseph Vath, III, Singapore, SG;
Loon Aik Lim, Singapore, SG;
Man Ho Hui, Singapore, SG;
Juay Sim Koh, Singapore, SG;
Assignee:
ASM Technology Singapore PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/514 ; B29C 7/078 ; B29C 3/342 ;
U.S. Cl.
CPC ...
B29C 4/514 ; B29C 7/078 ; B29C 3/342 ;
Abstract
A mold ( ) is for molding a one-sided encapsulated electronic device. The mold ( ) includes a first mold section ( ) defining a mold cavity ( ), and a second mold section ( ) including a first recessed portion ( ) adapted to receive a layer of material ( ) attached to a leadframe ( ), but not the leadframe ( ).