Gilbert, AZ, United States of America

Louis W Nicholls

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology, Inc., Mitsubishi Semiconductor America, Inc.. Active years: 1997-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Louis W Nicholls. Retrieved from https://idiyas.com/inventor/louis-w-nicholls

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 7

Forward Citations = 162(Granted Patents)


Location History:

  • Durham, NC (US) (1997 - 1998)
  • Gilbert, AZ (US) (1999 - 2024)

Company Filing History:


Years Active: 1997-2025

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Areas of Expertise:
Semiconductor Devices
Copper Pillar Package
TMV Packages
Die Size Enhancement
Electroplating
Plating Thickness
Error Detection
Ultrasonic Removal
18 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Louis W. Nicholls

Introduction

Louis W. Nicholls, an accomplished inventor based in Gilbert, AZ, has made significant contributions to the field of electronic component packaging. With an impressive portfolio of 17 patents, Nicholls has demonstrated his expertise and innovative spirit in developing advanced technologies that enhance semiconductor devices.

Latest Patents

Among his latest patents, the "Fine Pitch Copper Pillar Package and Method" stands out. This invention describes an electronic component package that features a substrate with a carefully designed upper surface. The traces on this surface extend longitudinally and possess a specific latitudinal width, which is essential for the functionality of the device. Rectangular copper pillars are strategically attached to bond pads of an electronic component, ensuring that the dimensions and alignment optimize the connectivity through solder joints.

Another notable patent is focused on "Semiconductor Devices and Methods of Manufacturing Semiconductor Devices." This innovation involves a substrate equipped with a conductive structure and multiple electronic components. It outlines a sophisticated configuration where components are interconnected in a manner that allows for streamlined assembly and enhanced performance. The design ensures that the component terminals face opposite directions, facilitating connection to higher-level assemblies.

Career Highlights

Louis W. Nicholls has had a notable career with significant roles at leading companies in the technology sector. He has worked with Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd., where he contributed to innovative advancements in semiconductor technology. His work is reflected in his extensive patent portfolio, showcasing his ability to address complex engineering challenges.

Collaborations

Throughout his career, Nicholls has collaborated with several talented individuals in the industry, including Robert Francis Darveaux and Roger D. St Amand. These partnerships have undoubtedly enriched his work and helped propel forward-thinking solutions in the realm of electronic components.

Conclusion

In summary, Louis W. Nicholls exemplifies the essence of innovation in the electronics field. With his remarkable track record of patents and collaborations, he continues to pave the way for future advancements in semiconductor packaging. His contributions are a testament to the impact that dedicated inventors can have on technology and the industries that depend on it.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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