The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Mar. 30, 2009
Robert Francis Darveaux, Gilbert, AZ (US);
David Mccann, Chandler, AZ (US);
John Mccormick, Chandler, AZ (US);
Louis W. Nicholls, Gilbert, AZ (US);
Robert Francis Darveaux, Gilbert, AZ (US);
David McCann, Chandler, AZ (US);
John McCormick, Chandler, AZ (US);
Louis W. Nicholls, Gilbert, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.