Company Filing History:
4 out of 1,009 
2 out of 291 
1 out of 1 Years Active: 2013-2025
Title: John McCormick: Innovator in Electronic Component Packaging
Introduction
John McCormick is a notable inventor based in Chandler, AZ (US), recognized for his contributions to electronic component packaging. With a total of 7 patents to his name, McCormick has made significant advancements in the field, particularly with his innovative designs and methods.
Latest Patents
One of McCormick's latest patents is the "Fine pitch copper pillar package and method." This electronic component package features a substrate with an upper surface, where traces extend in a longitudinal direction. The traces possess a first latitudinal width, which is perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, with the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars aligns with the first latitudinal width of the traces. Additionally, the longitudinal length of the copper pillars is parallel to the longitudinal direction of the trace and matches the length of the bond pads. The copper pillars are mounted to the traces using solder joints, showcasing McCormick's innovative approach to electronic packaging.
Career Highlights
Throughout his career, McCormick has worked with prominent companies in the industry, including Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to the development of cutting-edge technologies in electronic components.
Collaborations
McCormick has collaborated with several talented individuals in his field, including Robert Francis Darveaux and David McCann. These partnerships have fostered a creative environment that has led to the successful development of innovative solutions in electronic packaging.
Conclusion
John McCormick's contributions to electronic component packaging through his patents and collaborations highlight his role as a significant innovator in the industry. His work continues to influence advancements in technology and electronic design.