Company Filing History:

8 out of 1,009

Amkor Technology, Inc.

patents

2 out of 287

Amkor Technology Singapore Holding Pte. Ltd.

patents

1 out of 1

Amkor Technologies, Inc.

patent

Years Active: 2003-2025

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12191241 - Fine pitch copper pillar package and method (2025-01-07),

2. 11088064 - Fine pitch copper pillar package and method (2021-08-10),

3. 10418318 - Fine pitch copper pillar package and method (2019-09-17),

4. 10224270 - Fine pitch copper pillar package and method (2019-03-05),

5. 9462690 - Fine pitch copper pillar package and method (2016-10-04),

6. 8536458 - Fine pitch copper pillar package and method (2013-09-17),

7. 7064009 - Thermally enhanced chip scale lead on chip semiconductor package and method of making same (2006-06-20),

8. 7045883 - Thermally enhanced chip scale lead on chip semiconductor package and method of making same (2006-05-16),

9. 6873032 - Thermally enhanced chip scale lead on chip semiconductor package and method of making same (2005-03-29),

10. 6838309 - Flip-chip micromachine package using seal layer (2005-01-04),

11. 6597059 - Thermally enhanced chip scale lead on chip semiconductor package (2003-07-22),

Title: David McCann: Innovator in Electronic Component Packaging

Introduction

David McCann is a prominent inventor based in Chandler, AZ (US), known for his significant contributions to the field of electronic component packaging. With a total of 11 patents to his name, McCann has made a lasting impact on the industry through his innovative designs and methods.

Latest Patents

One of McCann's latest patents is the Fine Pitch Copper Pillar Package and Method. This electronic component package features a substrate with an upper surface, where traces extend in a longitudinal direction. The traces possess a first latitudinal width, which is perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of the electronic component, with the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars aligns with the first latitudinal width of the traces. Additionally, the longitudinal length of the copper pillars is parallel to the longitudinal direction of the trace and matches the length of the bond pads. The copper pillars are securely mounted to the traces using solder joints.

Career Highlights

Throughout his career, David McCann has worked with notable companies such as Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in electronic packaging technology.

Collaborations

McCann has collaborated with esteemed colleagues, including Robert Francis Darveaux and John McCormick. These partnerships have fostered a creative environment that has led to innovative solutions in the field.

Conclusion

David McCann's work in electronic component packaging exemplifies the spirit of innovation and dedication to advancing technology. His contributions continue to influence the industry and inspire future inventors.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.