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For the Inventor, By the Inventor

Munich, Germany

Lizabeth Keser

This inventor holds 11 USPTO granted patents and 3 published patent applications. Top assignee: Intel Corporation. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lizabeth Keser. Retrieved from https://idiyas.com/inventor/lizabeth-keser

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 90.9

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:

goldMedal11 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2019-2025

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11 patents (USPTO):Explore Patents
1. 12362251 - Fan out package with integrated peripheral devices and methods (2025-07-15),
2. 11955395 - Fan out package with integrated peripheral devices and methods (2024-04-09),
3. 11581287 - Chip scale thin 3D die stacked package (2023-02-14),
4. 11508637 - Fan out package and methods (2022-11-22),
5. 11404339 - Fan out package with integrated peripheral devices and methods (2022-08-02),
6. 11211337 - Face-up fan-out electronic package with passive components using a support (2021-12-28),
7. 10720393 - Molded substrate package in fan-out wafer level package (2020-07-21),
8. 10699980 - Fan out package with integrated peripheral devices and methods (2020-06-30),
9. 10665522 - Package including an integrated routing layer and a molded routing layer (2020-05-26),
10. 10546817 - Face-up fan-out electronic package with passive components using a support (2020-01-28),
11. 10403580 - Molded substrate package in fan-out wafer level package (2019-09-03),

Title: Lizabeth Keser: Innovator in Semiconductor Technology

Introduction

Lizabeth Keser is a prominent inventor based in Munich, Germany. She has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. Her work focuses on integrating peripheral devices into semiconductor packages, which has implications for the efficiency and functionality of electronic devices.

Latest Patents

One of Lizabeth's latest patents is titled "Fan out package with integrated peripheral devices and methods." This patent discloses a semiconductor device and method for including peripheral devices into a package. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. The patent illustrates configurations where the peripheral device is substantially the same thickness as a die or a die assembly. This innovative approach is utilized in a fan-out process to form advanced semiconductor devices.

Career Highlights

Lizabeth Keser has built a successful career at Intel Corporation, where she has been instrumental in developing cutting-edge technologies. Her expertise in semiconductor packaging has positioned her as a key player in the industry. Lizabeth's contributions have not only advanced her company’s goals but have also influenced the broader field of electronics.

Collaborations

Throughout her career, Lizabeth has collaborated with notable colleagues, including Thomas Wagner and Bernd Waidhas. These partnerships have fostered innovation and have led to the successful development of various technologies in the semiconductor space.

Conclusion

Lizabeth Keser is a trailblazer in semiconductor technology, with a remarkable portfolio of patents that reflect her innovative spirit. Her work continues to shape the future of electronic devices, making her a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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