logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10546817 B1

PDFFull Text
Expired
Date of Patent:
Jan. 28, 2020

Filed:

Dec. 28, 2017

Face-up fan-out electronic package with passive components using a support

Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Lizabeth Keser, Munich, DE;

Thomas Ort, Veitsbronn, DE;

Thomas Wagner, Regelsbach, DE;

Bernd Waidhas, Pettendorf, DE;

Assignee:

Intel IP Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Evren Seven

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/568 (2013.01); H01L 21/6836 (2013.01); H01L 24/14 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/0233 (2013.01);
Abstract

A face-up fan-out electronic package including at least one passive component located on a support. The electronic package can include a die. The die can include a plurality of conductive pillars having a proximal end communicatively coupled to the first side of the die and a distal end opposite the proximal end. A mold can at least partially surround the die. The mold can include a first surface that is coplanar with the distal end of the conductive pillars and a second surface opposing the first surface. In an example, the passive component can include a body and a lead. The passive component can be located within the mold. The lead can be coplanar with the first surface, and the body can be located at a distance from the second surface. The support can be located between the body and the second surface.

Find Patent Forward Citations

Keser, Lizabeth. (2020). Face-up fan-out electronic package with passive components using a support (U.S. Patent No. 10546817). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10546817

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…