Liqun Deng

Title: Innovations in 3D Integrated Circuit Design by Inventor Liqun Deng

Introduction

Liqun Deng, an accomplished inventor based in Shanghai, China, has made significant contributions to the field of integrated circuit design. With three patents to his name, his work focuses on innovative methods and systems that improve the efficiency of 3D integrated circuits (3D-IC). His expertise not only highlights his ingenuity but also illustrates the growing demand for advanced technologies in the realm of electronics.

Latest Patents

Liqun Deng holds notable patents, including the following:

1. **Methods, systems, and computer program products for efficiently implementing a 3D-IC**: This patent outlines an improved method for implementing a 3D-IC design featuring heterogeneous and/or homogeneous dies. It describes the identification of first and second die designs, generating a wrapper design for circuit components in the second die to facilitate concurrent implementations of both die designs. The design optimally utilizes a generated floorplan, enhancing the efficacy of its 3D electronic design.

2. **Electronic design 3D mixed placement and unfolding**: In this patent, Liqun Deng introduces an innovative approach for 3D-IC design that incorporates both mixed macro and standard cell placement. The method enables simultaneous placement of macros and standard cells onto stacked floorplans, thus optimizing instance locations based on timing, density, wire length, and floorplan constraints.

Career Highlights

Currently, Liqun Deng is associated with Cadence Design Systems, Inc., a leading company in electronic design automation. His role at Cadence reflects his commitment to pioneering advancements in circuit design, particularly in the challenging and rapidly evolving field of 3D-ICs.

Collaborations

Throughout his career, Liqun has collaborated with various industry experts. His notable coworkers include Miao Liu and Pinhong Chen, who contribute to creating a dynamic team focused on innovating electronic design methodologies. Miao Liu, in particular, adds a unique perspective to their collaborative efforts, fostering an inclusive environment of technological progress.

Conclusion

Liqun Deng's contributions to the field of 3D integrated circuit design are instrumental in shaping the future of electronics. With his innovative patents and collaborative spirit, he continues to drive advancements that will lead to more efficient and sophisticated electronic systems. As the demand for refined technology rises, inventors like Liqun will play an essential role in overcoming the challenges of modern circuit design.