For the Inventor, By the Inventor

Enter inventor name

Taichung, Taiwan

Lien-Chen Chiang

USPTO Granted Patents = 6 (Patent Applications = 2)

Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 258(Granted Patents)

Location History:

Taichung Hsien, TW (2007)
Taichung, TW (2002 - 2016)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2002-2016

Loading Chart...

6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9355989 - Wire bonding device and method of eliminating defective bonding wire (2016-05-31),

2. 7459770 - Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure (2008-12-02),

3. 7180161 - Lead frame for improving molding reliability and semiconductor package with the lead frame (2007-02-20),

4. 6696749 - Package structure having tapering support bars and leads (2004-02-24),

5. 6642735 - Semiconductor package for chip with testing contact pad connected to outside (2003-11-04),

6. 6476469 - Quad flat non-leaded package structure for housing CMOS sensor (2002-11-05),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…