The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2004
Filed:
Sep. 25, 2000
Chin-Yuan Hung, Taichung Hsien, TW;
Lien-Chen Chiang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Abstract
A package structure having tapering support bars and leads. The package structure has at least a lead frame, a die, a plurality of conductive wires and an encapsulating plastic body. The lead frame has a first surface and has at least a package unit. The package unit has a die pad, a plurality of leads and a plurality of support bars. The die pad is positioned in the middle. The leads and support bars are distributed around the periphery of the package unit. In addition, the width of the leads and support bars decreases gradually from a location close to the die pad towards the peripheral region. The leads and support bars have a rectangular or trapezoidal cross-section. A die is bonded on the surface of the die pad and the die is electrically connected to the leads on the lead frame via a plurality of conductive wires. Plastic material such as epoxy resin encloses the die, the conductive wires and the first surface of the lead frame.