Chin-Yuan Hung is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His innovative designs have advanced the efficiency and reliability of semiconductor devices.

Latest Patents

One of his latest patents is titled "Package structure having tapering support bars and leads." This invention features a package structure that includes a lead frame, a die, conductive wires, and an encapsulating plastic body. The design incorporates tapering support bars and leads that decrease in width from the die pad towards the peripheral region, enhancing the structural integrity of the package. Another notable patent is the "Multi-chip semiconductor package," which introduces a chip carrier designed to optimize space and improve the flow of molding compounds during encapsulation. This innovation addresses common issues such as incomplete filling and void formation, ensuring a more reliable semiconductor package.

Career Highlights

Chin-Yuan Hung is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in developing advanced packaging solutions that meet the growing demands of technology.

Collaborations

He has collaborated with notable coworkers, including Chang-Fu Chen and Lien-Chen Chiang, contributing to various projects that enhance semiconductor technology.

Conclusion

Chin-Yuan Hung's innovative patents and contributions to semiconductor packaging demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry positively.

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