The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2003
Filed:
Jan. 02, 2002
Applicant:
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/312 ;
Abstract
A photosensitive semiconductor package with a lid is proposed, in which a chip carrier is formed with an encapsulant thereon, and the encapsulant is formed with a cavity for exposing a semiconductor chip mounted on the chip carrier. A top of the encapsulant is structured with a groove and at least a beveled portion that descends toward the groove and is associated with the groove. When a lid is attached onto the encapsulant by using an adhesive, the groove can temporarily retain excess adhesive with its flow being directed toward the groove by the beveled portion, so that undersirable adhesive loss and adhesive flash can both be prevented from occurrence, allowing the appearance of the semiconductor package to be well maintained.