The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
Oct. 09, 2001
Abstract
A multi-hip semiconductor package is proposed, in which a first chip and a second chip are mounted on opposing surfaces of a lead frame in a staggered manner. This staggered arrangement assures the die bonding quality for firmly disposing the second chip in the semiconductor package without being detrimental affected by the first chip. Moreover, as both opposing surfaces of the lead frame have chips mounted thereon, a mold flow of a molding resin used in a molding process can be balanced, so that turbulence the mold flow is decreased, and void formation can be avoided. In addition, the semiconductor package can incorporate a third chip in a stacked manner with respect to the first or second chip. This therefore further improves the functionality and performance of the semiconductor package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile