The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Sep. 27, 2006
Wen-shan Tsai, Taichung, TW;
Chien-feng Wei, Taichung, TW;
Hung-wen Liu, Taichung, TW;
Ming Cheng Lin, Taichung, TW;
Lien-chen Chiang, Taichung, TW;
Wen-Shan Tsai, Taichung, TW;
Chien-Feng Wei, Taichung, TW;
Hung-Wen Liu, Taichung, TW;
Ming Cheng Lin, Taichung, TW;
Lien-Chen Chiang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Tantzu Taichung, TW;
Abstract
A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.