Taichung, Taiwan

Hung-Wen Liu

USPTO Granted Patents = 8 

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2008-2017

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8 patents (USPTO):Explore Patents

Title: Innovations of Inventor Hung-Wen Liu in Package Structure

Introduction

Hung-Wen Liu is a prolific inventor based in Taichung, Taiwan, recognized for his contributions to the field of electronics packaging. He holds a total of 8 patents, showcasing his innovation in developing methods and structures that enhance electronic assembly processes.

Latest Patents

Among his latest inventions are two notable patents focusing on minimizing manufacturing costs and improving efficiency in package structures. The first patent outlines a fabrication method that includes creating a dielectric layer on a metal carrier, forming conductive pillars, and encapsulating an electronic component, all while eliminating cumbersome manufacturing processes. The second patent further innovates on this theme by providing methods for fabricating package structures that forgo the traditional hole opening process. This not only simplifies the manufacturing steps but also contributes to cost reduction in semiconductor packaging.

Career Highlights

Hung-Wen Liu currently works for Siliconware Precision Industries Co., Ltd., a leader in semiconductor packaging and testing services. His role at the company allows him to apply his innovative ideas practically, advancing both his career and the technology within the industry.

Collaborations

Throughout his career, Liu has collaborated with esteemed colleagues in the field, including Yan-Heng Chen and Hsi-Chang Hsu. These partnerships enhance the scope of innovation, as they bring together diverse expertise to tackle complex engineering challenges.

Conclusion

Hung-Wen Liu’s innovative patents and contributions to electronic package structures stand as a testament to his skill as an inventor. His work not only pushes the boundaries of technology but also paves the way for future advancements in the semiconductor industry.

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