The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Jan. 02, 2014
Siliconware Precision Industries Co., Ltd, Taichung, TW;
Yan-Heng Chen, Taichung, TW;
Chun-Tang Lin, Taichung, TW;
Chieh-Yuan Chi, Taichung, TW;
Hung-Wen Liu, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
Disclosed is a method for fabricating a semiconductor package, including providing a package unit having an insulating layer and at least a semiconductor element embedded into the insulating layer, wherein the semiconductor element is exposed from the insulting layer and a plurality of recessed portions formed in the insulating layer; and electrically connecting a redistribution structure to the semiconductor element. The formation of the recessed portions release the stress of the insulating layer and prevent warpage of the insulating layer from taking place.