Liangfa Hu

Title: Innovations of Liangfa Hu in Semiconductor Processing

Introduction

Liangfa Hu is a prominent inventor based in San Jose, California, known for his significant contributions to semiconductor processing. With a total of six patents to his name, Hu has developed innovative methods and apparatus that enhance the efficiency and effectiveness of semiconductor device manufacturing.

Latest Patents

One of Hu's latest patents focuses on methods and apparatus for minimizing substrate backside damage during semiconductor device processing. This patent outlines a method of chucking a substrate in a substrate process chamber, which includes exposing the substrate to a plasma preheat treatment before applying a chucking voltage to a substrate support. The substrate support features a body that contains an electrode and a thermal control device. Additionally, a plurality of substrate supporting features are formed on the upper surface of the body, each designed with a substrate supporting surface and a rounded edge to further reduce damage.

Career Highlights

Throughout his career, Liangfa Hu has worked with notable organizations, including Applied Materials, Inc. and the Iowa State University Research Foundation, Inc. His experience in these institutions has allowed him to refine his expertise in semiconductor technologies and contribute to advancements in the field.

Collaborations

Hu has collaborated with several professionals in his field, including Abdul Aziz Khaja and Prashant Kumar Kulshreshtha. These collaborations have fostered a productive environment for innovation and development in semiconductor processing techniques.

Conclusion

Liangfa Hu's work in semiconductor processing exemplifies the impact of innovative thinking in technology. His patents and career achievements highlight his dedication to improving manufacturing processes in the semiconductor industry.