Li-Ya Tseng

Title: Innovations of Inventor Li-Ya Tseng

Introduction

Li-Ya Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuits and semiconductor technology. With a total of 2 patents, his work reflects a deep understanding of electronic design and innovation.

Latest Patents

Li-Ya Tseng's latest patents include an "Interface of Integrated Circuit Die and Method for Arranging Interface Thereof." This invention features a contact element pattern that corresponds to a parallel bus, arranged in an array of rows and columns. The design includes a transmitting group and a receiving group, with matching contact elements that align when geometrically rotated. Another significant patent is the "Semiconductor Structure of Work Unit Module," which incorporates an encircling noise-resistance structure and a P-type substrate. This structure is designed to enhance the performance and reliability of semiconductor devices.

Career Highlights

Throughout his career, Li-Ya Tseng has worked with prominent companies in the semiconductor industry, including Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas.

Collaborations

Li-Ya Tseng has collaborated with talented individuals in his field, including Ting-Hao Wang and Ting-Chin Cho. These collaborations have contributed to the advancement of technology in integrated circuits and semiconductor design.

Conclusion

Li-Ya Tseng's contributions to the field of integrated circuits and semiconductors are noteworthy. His innovative patents and collaborations highlight his expertise and commitment to advancing technology.