The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Dec. 28, 2020
Applicants:

Global Unichip Corporation, Hsinchu, TW;

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ting-Hao Wang, Hsinchu, TW;

Ting-Chin Cho, Hsinchu, TW;

Igor Elkanovich, Hsinchu, TW;

Amnon Parnass, Hsinchu, TW;

Chia-Hsiang Chang, Hsinchu, TW;

Tsai-Ming Yang, Hsinchu, TW;

Yen-Chung T. Chen, Santa Clara, CA (US);

Ting-Hsu Chien, Hsinchu, TW;

Yuan-Hung Lin, Hsinchu, TW;

Chao-Ching Huang, Hsinchu, TW;

Li-Ya Tseng, Hsinchu, TW;

Pei Yu, Hsinchu, TW;

Jia-Liang Chen, Hsinchu, TW;

Yen-Wei Chen, Hsinchu, TW;

Chung-Kai Wang, Hsinchu, TW;

Chun-Hsu Chen, Hsinchu, TW;

Yu-Ju Chang, Hsinchu, TW;

Li-Hua Lin, Hsinchu, TW;

Zanyu Yang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 24/06 (2013.01); H01L 25/0655 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 2224/0613 (2013.01);
Abstract

An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.


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