Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Li-Ya Tseng

Ting-Hao Wang

Wen-Tai Wang

Igor Elkanovich

Ting-Hsu Chien

Pei Yu

Jia-Liang Chen

Tsai-Ming Yang

Yen-Chung Tony Chen

Amnon Parnass

Chia-Hsiang Chang

Yuan-Hung Lin

Yu-Ju Chang

Ting-Chin Cho

Chung-Kai Wang

Li-Hua Lin

Chao-Ching Huang

Yen-Wei Chen

Zanyu Yang

Chun-Hsu Chen

Wei-Cheng Yu

Bo-Yan Li

An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180&#xb0; with respect to a row direction and a column direction.

Interface of integrated circuit die and method for arranging interface thereof

A semiconductor structure of a work unit module includes an encircling noise-resistance structure and a P-type substrate being defined with a chip region and a surrounding region surrounding the chip region. The surrounding area includes two first strip regions and two second strip regions. Each of the first strip regions is located between the second strip regions, and each of the second strip regions is located between the first strip regions. The encircling noise-resistance structure is located on the surrounding area, and includes first arrangement units and second arrangement units. The first arrangement unit is arranged in one of the first strip regions in a single row. The second arrangement unit is arranged in one of the second strip regions in a single row, and the long axis direction of the second arrangement unit is different from the long axis direction of the first arrangement unit.

Semiconductor structure of work unit module

Growing community of inventors

Hsinchu, Taiwan

Li-Ya Tseng