Li-Huan Chu

This inventor holds 30 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mediatek Corporation, TSMC Solar Ltd.. Active years: 1999-2026.

USPTO Granted Patents = 30 (Patent Applications = 5)

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 59(Granted Patents)

Company Filing History:

28 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 1999-2026

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Areas of Expertise:

Semiconductor Package Assembly

Dicing Method

Integrated Fan-Out Structures

Magnetic Shielding Material

Stacked Semiconductor Devices

Carrier Tape System

Printed Circuit Board

CIGS Solar Cell

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12525582 - Semiconductor package assembly and electronic device (2026-01-13),

2. 12237226 - Dicing method for stacked semiconductor devices (2025-02-25),

3. 12205859 - Package and printed circuit board attachment (2025-01-21),

4. 12159847 - Integrated fan-out structures and methods for forming the same (2024-12-03),

5. 12051624 - Stacked semiconductor devices and methods of forming thereof (2024-07-30),

6. 12016126 - Carrier tape system and components and methods of use (2024-06-18),

7. 11990423 - Magnetic shielding material with insulator-coated ferromagnetic particles (2024-05-21),

8. 11742276 - Semiconductor package and manufacturing process thereof (2023-08-29),

9. 11610827 - Package and printed circuit board attachment (2023-03-21),

10. 11527499 - Integrated fan-out structures and methods for forming the same (2022-12-13),

11. 11404383 - Magnetic shielding material with insulator-coated ferromagnetic particles (2022-08-02),

12. 11342291 - Semiconductor packages with crack preventing structure (2022-05-24),

13. 11315860 - Semiconductor package and manufacturing process thereof (2022-04-26),

14. 11240947 - Carrier tape system and components and methods of use (2022-02-01),

15. 11239143 - Semiconductor structure and manufacturing method thereof (2022-02-01),

Title: Inventor Li-Huan Chu - Revolutionizing Technology in Hsinchu

Introduction: Li-Huan Chu is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Li-Huan Chu holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Li-Huan Chu has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Throughout her career, Li-Huan Chu has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge-sharing in the tech industry.

Conclusion: Li-Huan Chu's dedication to innovation and her remarkable contributions to technology make her a standout figure in the field, inspiring future generations of inventors and innovators.