Li-Huan Chu

This inventor holds 30 USPTO granted patents and 5 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mediatek Corporation, TSMC Solar Ltd.. Active years: 1999-2026.

USPTO Granted Patents = 30 (Patent Applications = 5)

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 59(Granted Patents)

Company Filing History:

28 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 1999-2026

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Areas of Expertise:

Semiconductor Package Assembly

Dicing Method

Integrated Fan-Out Structures

Stacked Semiconductor Devices

Magnetic Shielding Material

Carrier Tape System

Printed Circuit Board

CIGS Solar Cell Structure

Thermal Annealing Method

Crack Preventing Structure

Wafer Structure

Bump Structure

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12525582 - Semiconductor package assembly and electronic device (2026-01-13),

2. 12237226 - Dicing method for stacked semiconductor devices (2025-02-25),

3. 12205859 - Package and printed circuit board attachment (2025-01-21),

4. 12159847 - Integrated fan-out structures and methods for forming the same (2024-12-03),

5. 12051624 - Stacked semiconductor devices and methods of forming thereof (2024-07-30),

6. 12016126 - Carrier tape system and components and methods of use (2024-06-18),

7. 11990423 - Magnetic shielding material with insulator-coated ferromagnetic particles (2024-05-21),

8. 11742276 - Semiconductor package and manufacturing process thereof (2023-08-29),

9. 11610827 - Package and printed circuit board attachment (2023-03-21),

10. 11527499 - Integrated fan-out structures and methods for forming the same (2022-12-13),

11. 11404383 - Magnetic shielding material with insulator-coated ferromagnetic particles (2022-08-02),

12. 11342291 - Semiconductor packages with crack preventing structure (2022-05-24),

13. 11315860 - Semiconductor package and manufacturing process thereof (2022-04-26),

14. 11240947 - Carrier tape system and components and methods of use (2022-02-01),

15. 11239143 - Semiconductor structure and manufacturing method thereof (2022-02-01),

Title: Inventor Li-Huan Chu - Revolutionizing Technology in Hsinchu

Introduction: Li-Huan Chu is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Li-Huan Chu holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Li-Huan Chu has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Throughout her career, Li-Huan Chu has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge-sharing in the tech industry.

Conclusion: Li-Huan Chu's dedication to innovation and her remarkable contributions to technology make her a standout figure in the field, inspiring future generations of inventors and innovators.