The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Mar. 04, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Sung-Sheng Chiu, Hsinchu, TW;
Pei-Haw Tsao, Tai-chung, TW;
Tsui-Mei Chen, Hsinchu, TW;
Shih-Hsing Lin, Zhubei, TW;
Li-Huan Chu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/02 (2006.01); H01L 21/683 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); B65B 9/04 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H05K 13/021 (2013.01); B65B 9/045 (2013.01); H01L 21/6836 (2013.01); H05K 13/0084 (2013.01); H05K 13/0419 (2018.08); H01L 21/673 (2013.01);
Abstract
The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.