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For the Inventor, By the Inventor

Fremont, CA, United States of America

Leah Miller

USPTO Granted Patents = 19

Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 141(Granted Patents)


Company Filing History:

goldMedal14 out of 3,715 
 
Lsi Logic Corporation
 patents
silverMedal5 out of 2,353 
 
Lsi Corporation
 patents

Years Active: 2002-2010

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19 patents (USPTO):
1. 7829424 - Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs (2010-11-09),
2. 7791210 - Semiconductor package having discrete non-active electrical components incorporated into the package (2010-09-07),
3. 7508062 - Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs (2009-03-24),
4. 7414322 - High speed interface design (2008-08-19),
5. 7319272 - Ball assignment system (2008-01-15),
6. 7298036 - Scaling of functional assignments in packages (2007-11-20),
7. 7062742 - Routing structure for transceiver core (2006-06-13),
8. 7051434 - Designing a ball assignment for a ball grid array package (2006-05-30),
9. 6963129 - Multi-chip package having a contiguous heat spreader assembly (2005-11-08),
10. 6858930 - Multi chip module (2005-02-22),
11. 6791177 - Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate (2004-09-14),
12. 6768386 - Dual clock package option (2004-07-27),
13. 6762366 - Ball assignment for ball grid array package (2004-07-13),
14. 6744130 - Isolated stripline structure (2004-06-01),
15. 6701270 - Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source (2004-03-02),

Title: Innovations by Leah Miller: Pioneering Advances in Semiconductor Packaging

Introduction

Leah Miller, a prominent inventor based in Fremont, California, has made significant contributions to the field of semiconductor packaging. With a total of 19 patents to her name, Miller's work focuses on enhancing the functionality and efficiency of integrated circuit packages. Her latest innovations demonstrate remarkable ingenuity, addressing pressing challenges in electronic design.

Latest Patents

One of Leah Miller's latest patents is titled "Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs." This invention presents a novel method for fabricating an integrated circuit package that incorporates decoupling capacitors. By using a package design originally conceived without these capacitors, her method allows for minimal redesign while maintaining the signal trace pattern. The approach involves replacing traditional bond pads with via straps and using a dielectric layer with conductive vias, facilitating the electrical connection without disrupting signal planes.

Another significant patent by Miller is for a "Semiconductor package having discrete non-active electrical components incorporated into the package." This innovation features a semiconductor integrated circuit package that includes a substrate with an integrated circuit die and at least one signal layer. Notably, the discrete non-active electrical component is mounted within the package, allowing for enhanced electrical connectivity without compromising design integrity.

Career Highlights

Leah Miller has previously worked at LSI Logic Corporation and LSI Corporation, where she has honed her skills and contributed to advancing semiconductor technologies. Her work in these companies has positioned her as a key figure in innovation within the industry. The experience gained during her tenure at these organizations has greatly influenced her inventive endeavors.

Collaborations

Throughout her career, Miller has collaborated with notable professionals, including Aritharan Thurairajaratnam and Edwin M Fulcher. These partnerships have resulted in a collective advancement of ideas and have contributed to the successful development of her patents.

Conclusion

Leah Miller's innovative spirit and dedication to the field of semiconductor packaging have led to the creation of cutting-edge technologies that are shaping the future of electronic design. Her 19 patents exemplify her commitment to finding solutions to complex engineering challenges. As she continues to explore new frontiers in her field, her contributions will undoubtedly have a lasting impact on the industry.

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