The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
Jul. 08, 2003
Leah M. Miller, Fremont, CA (US);
Aritharan Thurairajaratnam, San Jose, CA (US);
Edwin M. Fulcher, Palo Alto, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A package substrate having separate routing layers for transmitter signals and receiver signals, which signals are routed in differential pairs. The differential pairs of signal routing lines are isolated between a separate ground plane for transmitter and receiver traces and dedicated power planes, where a single power plane is dedicated to a single differential pair of signal routing lines. In this manner, a high degree of electrical isolation exists not only between the transmitter signal traces and the receiver signal traces, which are on different layers, but also between different differential pairs of signal routing lines on the same layer, each of which has its own dedicated power plane. Thus, a very high speed core routing system can be designed in a package substrate that can then be adapted as necessary to support a broad range of different integrated circuit designs.