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Walworth, NY, United States of America

Lawrence H Herko

This inventor holds 8 USPTO granted patents. Top assignee: Xerox Corporation. Active years: 1994-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lawrence H Herko. Retrieved from https://idiyas.com/inventor/lawrence-h-herko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 113(Granted Patents)

Location History:

Walworth, NY (US) (1994 - 1997)
Palmyra, NY (US) (1995 - 2002)

Company Filing History:

8 out of 24,261

Xerox Corporation

Years Active: 1994-2002

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6436793 - Methods of forming semiconductor structure (2002-08-20),

2. 5668061 - Method of back cutting silicon wafers during a dicing procedure (1997-09-16),

3. 5637388 - Layered resinoid/diamond blade for precision cutting operations and (1997-06-10),

4. 5515089 - Ink jet printhead with sealed manifold and printhead die (1996-05-07),

5. 5506610 - Back side relief on thermal ink jet die assembly (1996-04-09),

6. 5494698 - Teflon filled resinoid dicing blades for fabricating silicon die modules (1996-02-27),

7. 5408739 - Two-step dieing process to form an ink jet face (1995-04-25),

8. 5306370 - Method of reducing chipping and contamination of reservoirs and channels (1994-04-26),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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