The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Dec. 28, 2000
Gary A. Kneezel, Webster, NY (US);
Daniel E. Kuhman, Fairport, NY (US);
Brian T. Ormond, Webster, NY (US);
Ackerman C. John, Rochester, NY (US);
Almon P. Fisher, Rochester, NY (US);
Allan F. Camp, Brockport, NY (US);
Lawrence H. Herko, Palmyra, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.