Allan F Camp

Title: Allan F Camp: Innovator in Semiconductor and Wiring Technologies

Introduction

Allan F Camp is a notable inventor based in Brockport, NY (US). He has made significant contributions to the fields of semiconductor structures and printed wiring technologies. With a total of 2 patents, his work has had a lasting impact on the industry.

Latest Patents

Allan F Camp's latest patents include a method of making a wear-resistant printed wiring member. This innovative method involves several steps, including providing a blank printed wiring member, masking regions of the copper foil, and depositing a nickel coating followed by a hard gold layer. The process enhances the bondability of contact pads while maintaining the wear resistance of connector pads. Another significant patent is related to methods of forming semiconductor structures. This method involves bonding two wafers and forming grooves to expose alignment reference targets, which are crucial for creating semiconductor structures.

Career Highlights

Throughout his career, Allan has worked with prominent companies such as Xerox Corporation and Eastman Kodak Company. His experience in these organizations has allowed him to develop and refine his innovative techniques in the field of technology.

Collaborations

Allan has collaborated with notable individuals in his field, including Gary Alan Kneezel and Daniel E Kuhman. These collaborations have contributed to the advancement of his inventions and the overall progress in the industry.

Conclusion

Allan F Camp's contributions to innovations in semiconductor and wiring technologies demonstrate his expertise and commitment to advancing these fields. His patents reflect a deep understanding of the technical challenges and solutions in modern electronics.