The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
May. 26, 2011
Samuel Chen, Penfield, NY (US);
Allan F. Camp, Brockport, NY (US);
Charles I. Levey, West Henrietta, NY (US);
Vincent J. Andrews, Rochester, NY (US);
Samuel Chen, Penfield, NY (US);
Allan F. Camp, Brockport, NY (US);
Charles I. Levey, West Henrietta, NY (US);
Vincent J. Andrews, Rochester, NY (US);
Eastman Kodak Company, Rochester, NY (US);
Abstract
A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.