Charles I Levey

Title: Charles I Levey: Innovator in Printed Wiring Technology

Introduction:

Charles I Levey, a highly skilled inventor and engineer hailing from West Henrietta, NY, has made significant contributions in the field of printed wiring technology. With 14 patents to his name, Levey has consistently demonstrated his expertise and passion for developing methods to enhance the durability and functionality of printed wiring members. This article delves into his latest patented inventions and highlights some of the companies he has worked for, as well as his collaborations with notable colleagues.

Latest Patents:

Method of making bondable printed wiring member:

Levey's patent describes a technique for producing a printed wiring member with wire-bondable contact pads and wear-resistant connector pads. The method involves several key steps: providing a copper foil laminated to a dielectric substrate, masking the blank printed wiring member to preserve certain regions of the copper foil, selectively removing copper to create a patterned printed wiring member, depositing a nickel coating using an electroless nickel deposition process, applying a gold layer using an electroless gold deposition process, and finally depositing palladium on top of the gold layer to enhance wear resistance without compromising bondability.

Method of making wear-resistant printed wiring member:

Another of Levey's patented innovations focuses on producing a robust printed wiring member with wire-bondable contact pads and wear-resistant connector pads. This method involves steps similar to the previous patent, including the provision of a copper foil laminated to a dielectric substrate and the creation of a patterned printed wiring member by selectively removing copper. However, this technique differs in the subsequent steps of depositing a nickel coating, electrolytically depositing a hard gold layer, and adding a palladium surface layer. This unique combination enhances bondability while ensuring the connector pads remain highly resistant to wear.

Professional Experience:

Levey's expertise has been honed through his work at reputable companies, notably Eastman Kodak Company and Global OLED Technology LLC. While the former is widely recognized for its contributions to the imaging industry, Global OLED Technology LLC specializes in organic light-emitting diode (OLED) technology, making it clear that Levey possesses versatility, having expanded his knowledge across different sectors.

Collaborations:

Throughout his career, Levey has had the opportunity to collaborate with esteemed colleagues, including John Hamer and Gary Parrett. Their partnerships have likely fostered an environment of innovation, enabling the development of novel solutions and pushing the boundaries of printed wiring technology.

Conclusion:

Charles I Levey's impressive portfolio of 14 patents and his involvement with renowned companies attest to his commitment to advancements in printed wiring technology. His latest inventions demonstrate a focus on creating printed wiring members with wire-bondable contact pads and wear-resistant connector pads. Through his unwavering passion and collaborations with esteemed colleagues, Levey has undoubtedly left a lasting impact on the field of innovations and patents related to printed wiring technology.