The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Nov. 30, 2009
Samuel Chen, Penfield, NY (US);
Charles I. Levey, West Henrietta, NY (US);
Samuel Chen, Penfield, NY (US);
Charles I. Levey, West Henrietta, NY (US);
Eastman Kodak Company, Rochester, NY (US);
Abstract
A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes the steps of a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member using an electroless nickel deposition process; e) depositing a gold layer on the nickel coating using an electroless gold deposition process; and f) depositing palladium on the gold layer using an electroless palladium deposition process to improve wear resistance of the connector pads while preserving bondability of the contact pads.