The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
Nov. 02, 1992
Lawrence H Herko, Walworth, NY (US);
Robert P Altavela, Pittsford, NY (US);
Joseph R Weber, Rochester, NY (US);
Robert M White, Rochester, NY (US);
Kathryn A Wallace, Canandaigua, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
A method of fabricating thermal ink jet printheads comprises aligning and bonding a pair of silicon wafers together, which have, on opposing confronting surface thereof, a plurality of sets of linear arrays of heating elements and associated driver circuitry on one wafer surface and a plurality of sets of parallel grooves and a communicating reservoir for each set of grooves. The grooves and reservoirs are filled with a filler material which is solid or gels at room temperature and liquid at higher temperatures. The bonded pair of wafers are severed into a plurality of individual printhead sby dicing processes conducted at room temperature. One of the dicing processes cuts the grooves in a direction perpendicular thereto in order to form concurrently the nozzle face and nozzles. The solid filler material supports fragile edges of the wafers and prevents entry of dicing debris and other contaminants. The printheads are subjected to heat, spinning, and high pressure water spray to remove the filler material.