The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1996
Filed:
Jan. 30, 1995
Robert P Altavela, Pittsford, NY (US);
Lawrence H Herko, Palmyra, NY (US);
Almon P Fisher, Rochester, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
A method of dicing a printhead wafer containing a plurality of individual print elements into discreet elements. A back side relief feature is formed on the bottom front edge of a thermal ink jet print element from a heater side during a first dicing cut, followed by a second dicing cut from a channel side of the wafer to form a front face nozzle. The back cut feature enables front face maintenance by a wiper blade or other maintenance operation, provides a pocket for excess die bonding adhesive during manufacture, and reduces front face chipping during dicing caused by the saw blade contacting the die wafer mounting media and becoming contaminated. The relief feature may be a square step feature or a beveled back cut feature and may additionally be located on a top front edge of the print element.