Noblesville, IN, United States of America

Larry M Mandel


 

Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 153(Granted Patents)


Location History:

  • Noblesville, IN (2008)
  • Nobelsville, IN (US) (2008)
  • Noblesville, IN (US) (2004 - 2009)

Company Filing History:


Years Active: 2004-2009

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9 patents (USPTO):Explore Patents

Title: The Innovative Mind of Larry M. Mandel

Introduction

Larry M. Mandel is a distinguished inventor based in Noblesville, Indiana, USA. With a total of 9 patents to his name, he has made significant contributions to the field of electronic assembly. His innovative approaches have not only enhanced the functionality of electronic devices but also improved their reliability and performance in various applications.

Latest Patents

Larry's latest patents showcase his expertise in overmolded electronic assemblies. One notable invention is the "Wrap-around overmold for electronic assembly." This invention comprises an improved overmolded electronic assembly featuring a backplate with a recessed edge. This design incorporates a circuit substrate and at least one electronic component, which, along with the conductive traces, forms a robust circuit device. The unique overmold body wraps around the edges of the backplate, significantly reducing the delamination issues that can arise during thermal cycling. It also enhances corrosion resistance at the connector-to-backplate interfaces and securely attaches the printed circuit board assembly along with the electrical connector.

Another patent titled "Overmolded electronic assembly" describes a partially overmolded component that includes a precisely defined overmolding edge. This design has a protruding elongate rib, which increases the area of contact between the component and the overmolding tool. The resulting structure creates a more complex flow path, minimizing bleed-through during the manufacturing process.

Career Highlights

Larry M. Mandel is currently associated with Delphi Technologies, Inc., where he continues to push the boundaries of innovation in electronic components. His contributions have helped the company maintain its position as a leader in automotive electronics and advanced technology solutions.

Collaborations

Throughout his career, Larry has worked alongside talented colleagues, including Kin Yean Chow and Ching Meng Fang. Their collaborative efforts have resulted in groundbreaking advancements in the field, further exemplifying the importance of teamwork in fostering innovation and achieving engineering excellence.

Conclusion

Larry M. Mandel's inventive spirit and commitment to innovation have earned him recognition in the realm of electronic assembly. His patents reflect a deep understanding of engineering challenges and a drive to develop practical solutions. As technology continues to evolve, Larry's contributions will undoubtedly play a crucial role in shaping the future of electronic components.

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